Call for Papers
Submission deadline has been extended to 23 June 2019
You can submit your paper using the edas link.
IEEE CAMAD is soliciting papers describing original work, unpublished and not currently submitted for publication elsewhere, on topics including, but not limited to, the following:
- Wireless PHY layers for 5G: design, analysis, and optimization
- Wireless MAC protocols for 5G: design, analysis, and optimization
- 5G IoT networks, Platforms, Integration and Services
- 5G Multitenant Networks and End-to-End Network slicing
- Adaptive content distribution in on-demand services
- Backhaul/fronthaul for multi-tier ultra-dense heterogeneous small cell networks
- Cognitive and Cooperative Communications
- Commercial and Societal Impact of Networks, Data, and Adaptive Services
- Context and location-aware wireless services and applications
- Cross-layer design for massive MIMO and multiuser MIMO networks
- Circular economy for ICT
- Software-Defined Networking (SDN) Architectures and Networks
- Machine-Learning and Artificial Intelligence
- Efficient integration of multiple novel 5G air interfaces
- Energy efficiency and Energy harvesting in wireless networks
- Mobile big data and network data analytics
- Mobile Edge and Fog Computing Systems
- Blockchain and Forecasting: Prediction markets & oracles
- Convergence of Blockchains with Artificial Intelligence (AI), Internet of Things (IoT), and Virtual Reality (VR)
- Bringing out the Data: Blockchain-based Applications
- Mobile social networks
- Security, Privacy and Trust by Design and Performance Evaluation
- Mobility, location, and handoff management
- Multimedia QoS, and traffic management
- Multiple access in machine-to-machine communication
- Network estimation techniques
- Optical Communications & Fiber Optics for 5G
- Quality of Experience: Framework, Evaluation and Challenges
- Smart Grids: Communication, Modeling and Design
- Testbed, experiments, and prototype implementations of systems & services for 5G
- Ultra low-latency and ultra high-reliability
- Validation of Simulation Models with Measurements
- Wireless body area networks and e-health services
- Wireless broadcast, multicast and streaming
Submissions
Prospective authors are invited to submit a full paper with a maximum paper length of six (6) pages including results, figures and references without incurring additional page charges (maximum 1 additional page with over length page charge for an additional fee, if accepted), in the standard IEEE two-column conference format. Papers should be submitted via EDAS. Papers submitted to the conference, must describe unpublished work that has not been submitted for publication elsewhere. All submitted papers will be reviewed by at least three TPC members. All accepted and presented papers will be included in the conference proceedings and IEEE digital library. Please note that for every accepted contribution, at least one person must register for the conference and present. Accepted papers not presented in the conference will be excluded from the proceedings.
You can submit your paper using the edas link.
Preparation of manuscripts in the appropriate format
IEEE eXpress Conference Publishing provides these optional MS Word and LaTeX templates free for use. If you wish, you may link to this Web page in its entirety. However, we do not recommend that you link to individual files because they may be updated or replaced without notice.
Accessing the templates (more can be found at https://www.ieee.org/conferences/publishing/templates.html)
Microsoft Word
LaTeX Template Instructions (PDF, 63 KB)
- Template (ZIP, 700 KB) Updated July 2018
LateX Bibliography Files
- Windows (ZIP, 309 KB)
Tips: Be sure to use the template’s conference mode. See template documentation for details. Select Save when the File Download window appears. The files cannot open directly from the server.
Overleaf
- Please visit Overleaf and sign in using your IEEE Account to utilize the templates and collaboration features of Overleaf.
If you have any questions regarding the submission of manuscripts, please contact one of the Technical Program Chairs.